一、常用PCB专用术语1
双面板:double sided board
多层板:multilayer board
刚性板:rigid board
挠性板:flexible board
刚挠板:flex-rigid board
PCB打样:PrintedCircuitBoard proofing
附件:attached
样品:sample
承认:approval
答复:answer;reply
规格:spec
与...同样的:the same as
前版本:previous version(old version)
生产:production
确认:confirm
再次确认:double confirm
工程问题:engineering query(EQ)
尽快:ASAP(as soon as possible)
生产文件:production gerber
联系某人:contact somebody
提交样板:submit sample
交货期:delivery date
电测成本:ET(electrical test) cost
通断测试:Open and short testing
参考:refer to IPC
标准:IPC standard
IPC二级:IPC class 2
可接受的:acceptable
二、常用PCB专用术语2
允许:permit
制造:manufacture
修改:revision
公差:tolerance
忽略:ignore(omit)
工具孔:tooling hole
安装孔:mounting hole
元件孔:component hole
槽孔:slot
邮票孔:snap off hole
导通孔:via
盲孔:blind via
埋孔:buried via
金属化孔:PTH(plating through hole)
非金属化孔:NPTH( no plating through hole)
孔位:hole location
避免:avoid
原设计:original design
修改:modify
按原设计:leave it as it is
附边:waste tab
铜条:copper strip
拼板强度:panel strong
板厚:board thickness
删除:remove(delete)
削铜:shave the copper
露铜:copper exposure
光标点:fiducial mark
不同:bedifferentfrom(differfrom)
内弧:inside radius
焊环:annular ring
单板尺寸:single size
拼板尺寸:panel size
铣:routing
铣刀:router
V-cut:scoring
哑光:matt
光亮的:glossy
锡珠:solderball(solderplugs)
三、常用PCB专用术语3
阻焊:solder mask(solder resist)
阻焊开窗:solder mask opening
单面开窗:single side mask opening
补油:touch up solder mask
补线:track welds
毛刺:burrs
去毛刺:deburr
镀层厚度:plating thickness
清洁度:cleanliness
离子污染:ionic contamination
阻燃性:flammabilityretardant
黑化:blackoxidation
棕化:brown oxidation
红化:red oxidation
可焊性:solderability
焊料:solder
包装:packaging
角标:corner mark
特性阻抗:characteristic impedance
正像:positive
负片:negative
镜像:mirror
线宽:conductor width
线距:conductor spacing
做样:build sample
按照:asper
成品:finished
做变更:makethechang
相类似:similar to
规格:specification
下移:shift down
垂直地:vertically
水平的:horizontally
增大:increase
缩小:decrease
表面处理:SurfaceFinishing
波峰焊:wavesolder
钻孔数据:drillingdate
标记:LogoUl
标记:Ul Marking
蚀刻标记:etchedmarking
周期:datecode
翘曲:bowandtwist
外层:outer layer
内层:internallayer
顶层:toplayer
底层:bottomlayer
元件面:componentside
焊接面:solderside
阻焊层:solder masklayer
丝印层:legend layer (silkscreen layer or over layer)
四、常用PCB专用术语4
兰胶层:peelableSMlayer
贴片层:pastemasklayer
碳油层:carbon layer
外形层:outlinelayer(profilelayer)
白油:whiteink
绿油:greenink
喷锡:hotairleveling(HAL)
水金:flashgold
插头镀金:platedgoldedge-boardcontacts
金手指:Gold-finger
防氧化:Entek(OSP)
沉金:Immersiongold (chem.Gold)
沉锡:ImmersionTin(chem.Tin)
沉银:ImmersionSilver(chem.silver)
铣:CNC(mill,routing)
冲:punching
倒角:beveling
倒斜角:chamfer
倒圆角:fillet
尺寸:dimension