一、常用PCB专用术语1

双面板：double sided board

多层板：multilayer board

刚性板：rigid board

挠性板：flexible board

刚挠板：flex-rigid board

PCB打样：PrintedCircuitBoard proofing

附件：attached

样品：sample

承认：approval

答复：answer;reply

规格：spec

与...同样的：the same as

前版本：previous version(old version)

生产：production

确认：confirm

再次确认：double confirm

工程问题：engineering query（EQ）

尽快：ASAP(as soon as possible)

生产文件：production gerber

联系某人：contact somebody

提交样板：submit sample

交货期：delivery date

电测成本：ET（electrical test） cost

通断测试：Open and short testing

参考：refer to IPC

标准：IPC standard

IPC二级：IPC class 2

可接受的：acceptable

二、常用PCB专用术语2

允许：permit

制造：manufacture

修改：revision

公差：tolerance

忽略：ignore(omit)

工具孔：tooling hole

安装孔：mounting hole

元件孔：component hole

槽孔：slot

邮票孔：snap off hole

导通孔：via

盲孔：blind via

埋孔：buried via

金属化孔：PTH(plating through hole)

非金属化孔：NPTH( no plating through hole)

孔位：hole location

避免：avoid

原设计：original design

修改：modify

按原设计：leave it as it is

附边：waste tab

铜条：copper strip

拼板强度：panel strong

板厚：board thickness

删除：remove(delete)

削铜：shave the copper

露铜：copper exposure

光标点：fiducial mark

不同：bedifferentfrom(differfrom)

内弧：inside radius

焊环：annular ring

单板尺寸：single size

拼板尺寸：panel size

铣：routing

铣刀：router

V-cut：scoring

哑光：matt

光亮的：glossy

锡珠：solderball(solderplugs)

三、常用PCB专用术语3

阻焊：solder mask(solder resist)

阻焊开窗：solder mask opening

单面开窗：single side mask opening

补油：touch up solder mask

补线：track welds

毛刺：burrs

去毛刺：deburr

镀层厚度：plating thickness

清洁度：cleanliness

离子污染：ionic contamination

阻燃性：flammabilityretardant

黑化：blackoxidation

棕化：brown oxidation

红化：red oxidation

可焊性：solderability

焊料：solder

包装：packaging

角标：corner mark

特性阻抗：characteristic impedance

正像：positive

负片：negative

镜像：mirror

线宽：conductor width

线距：conductor spacing

做样：build sample

按照：asper

成品：finished

做变更：makethechang

相类似：similar to

规格：specification

下移：shift down

垂直地：vertically

水平的：horizontally

增大：increase

缩小：decrease

表面处理：SurfaceFinishing

波峰焊：wavesolder

钻孔数据：drillingdate

标记：LogoUl

标记：Ul Marking

蚀刻标记：etchedmarking

周期：datecode

翘曲：bowandtwist

外层：outer layer

内层：internallayer

顶层：toplayer

底层：bottomlayer

元件面：componentside

焊接面：solderside

阻焊层：solder masklayer

丝印层：legend layer (silkscreen layer or over layer)

四、常用PCB专用术语4

兰胶层：peelableSMlayer

贴片层：pastemasklayer

碳油层：carbon layer

外形层：outlinelayer(profilelayer)

白油：whiteink

绿油：greenink

喷锡：hotairleveling(HAL)

水金：flashgold

插头镀金：platedgoldedge-boardcontacts

金手指：Gold-finger

防氧化：Entek(OSP)

沉金：Immersiongold (chem.Gold)

沉锡：ImmersionTin(chem.Tin)

沉银：ImmersionSilver(chem.silver)

铣：CNC(mill,routing)

冲：punching

倒角：beveling

倒斜角：chamfer

倒圆角：fillet

尺寸：dimension