碱性镀铜,alkaline copper plating
1)alkaline copper plating碱性镀铜
1.Review of HEDP direct copper plating process on iron and steel workpiece after 30 years of development——Part III. Wastewater treatment of HEDP and otheralkaline copper plating solutions钢铁件HEDP直接镀铜工艺开发30年回顾 第三部分——HEDP及其他碱性镀铜液的废水处理
2.Review of HEDP direct copper plating process on iron and steel workpiece after 30 years of development—Part Ⅱ. Properties of HEDPalkaline copper plating and main points of maintenance钢铁件HEDP直接镀铜工艺开发30年回顾 第二部分──HEDP碱性镀铜的性能与维护要点
英文短句/例句
1.The study of electrochemical behaviors for a citrate alkaline copper plating bath柠檬酸盐碱性镀铜的电化学行为研究
2.Copper Electroplating in Alkaline Bath Containing Novel Brightening Agent采用新型组合光亮剂的碱性镀铜研究
3.Investigation on Cyanide-free Alkaline Copper Electroplating and Eletrochemical Behavior无氰碱性镀铜工艺及其电化学过程的研究
4.Investigation on Anticarbonized Bright Copper-plating Process in Basic Cyanide Baths碱性氰化物防渗碳光亮镀铜工艺的研究
5.The adhesive strength of the acid film was stronger than that of the alkali film.碱性镀层的结合强度优越于酸性镀层。
6.To coat or finish with a layer of copper.镀铜于给…包铜或镀铜
7.PERFORMANCE OF ELECTROLESS Ni-P COATING ON W-Cu ALLOY钨铜合金表面化学镀Ni-P镀层性能研究
8.RECOVERY OF Cu FROM ACIDIC COPPER RINSE WATER槽边循环电解法从酸性镀铜废水中回收铜
9.High Speed Acidic Electroplating Technology of Compact and Bright Sn and Sn-Cu Alloy for Copper Wire铜线材酸性高速电镀致密光亮锡、锡铜合金
10.Research into Microstructure and Property of CF/Cu(C)-Cu Composite;碳纤维/镀铜石墨—铜复合材料组织与性能研究
11.Hot Tinning Process of Copper-constantan Thermocouples and Thermometric Characteristics Analysis铜-康铜热电偶的热镀锡膜工艺和测温特性分析
12.Alkaline Zineate Bright Zn Plating with 880 Brightener以880为光亮剂的碱性锌酸盐光亮镀锌
13.The Influence Factors on Nickel Content of Alkaline Zn-Ni Alloys Coating碱性锌镍合金镀层镍含量的影响因素
14.HKS-315 Alkaline Zn-Ni Alloy PlatingHKS-315碱性电镀锌镍合金工艺
15.Study on the Technology of Bright Copper Plating in Acidic Copper Sulphate Solution With Additive Agent“153”“153”酸性硫酸铜光亮电镀工艺的研究
16.Automatic Potential Titration Analysis on Bright Acid Electroplating Copper Bath自动电位滴定分析光亮酸性镀铜溶液
17.Study on electrodeposition process and properties of copper–tungsten composite coating铜-钨复合镀层电沉积工艺及其性能
18.Study on Technique and Electrochemical Mechanism of Acidic Copper Electroplating of Z-type BrightenerZ型光亮剂酸性镀铜工艺及机理研究
相关短句/例句
Alkaloid coppered liquid碱性镀铜液
3)alkaline cyanide-free copper plating碱性无氰镀铜
1.Analkaline cyanide-free copper plating technology suitable for copper preplating on iron and steel substrates and for directly thick copper plating was established through tests of properties of plating bath and the coatings.通过对碱性无氰镀铜工艺、镀液及镀层性能研究,得到该工艺可作为钢铁基体的预镀铜,也可直接用于镀厚铜,镀层与基体的结合力良好,结晶细致,光亮。
4)cyanide-free alkaline copper无氰碱性镀铜
5)acid copper plating酸性镀铜
1.The influences of the intermediate and monomer brighteners commonly used in presentacid copper plating on the hardnes.本文主要对目前国内外常见的酸性镀铜中间体、单体光亮剂对硬度的影响进行了测试研究。
2.The absorption curves of the brightener UBAC 1A of brightacid copper plating and cupric sulfate of the bath were mensurated by experiments respectively.通过实验分别测定了酸性镀铜光亮剂UBAC 1A和镀液中硫酸铜的吸收曲线。
6)acidic copper plating酸性镀铜
1.Experimental study was carried out on the preplafing technology of Acidic copper plating for iron and steel.实验研究了钢铁件酸性镀铜前的预镀工艺,确定了硫脲浸铜工艺,讨论了工艺中各成分及含量对镀层结合力的影响,得到了硫脲浸铜工艺的成分及最佳含量,硫酸铜10～12g/L、硫酸75～100 mL/L、硫脲0。
2.A brightener foracidic copper plating had been presented.介绍了酸性镀铜光亮剂 ,并与使用较多的两种国外酸铜光亮剂的阴极极化曲线、镀液的深镀能力、均镀能力、耐温工作范围等作了对比。
3.The formula for brightacidic copper plating technics and the operating conditions are presented and theacidic copper plating brightener is evaluated through comparative tests.在酸性镀铜电解液中要获得良好的镀铜层,关键在于选择性能优良的酸性镀铜光亮剂,而酸性镀铜光亮剂的开发关键在于中间体的选择和复配。
延伸阅读
镀铜镀铜copper coatingdUtong镀铜(eopper eoating)在酸洗后的盘条(线坯)表面镀覆一层铜，以作为拉丝时的润滑载体。以铜层作润滑载体主要用在拉拔轮胎钢丝与气体保护焊丝等特殊场合，这时铜层除用作润滑载体外，可提高轮胎钢丝同橡胶的结合力和焊丝的导电性。此外也用于弹妥钢丝等的生产中，以改善拉拔时的润滑性能及产品的表面质量。镀铜操作时，把盘条浸入加有一定硫酸和骨胶的硫酸铜溶液中。根据电位序，铁能置换铜: Fe+CuZ+-今Cu+FeZ+并很快发生下列反应和完成镀铜过程Fe+CuSO;一FeSO‘+Cu专硫酸铜是溶液的主要镀剂，提供铜离子的来源，浓度通常控制在60一7馆/L。浓度过低，将延长镀铜时间且不易获得所需厚度的镀层;浓度过高，则铜的沉积速度过快，导致铜结晶迅速长大，使镀层疏松、粗糙，影响与基体的结合。硫酸的主要作用是活化盘条表面，使铜层能与基体牢固结合。骨胶有促使铜与基体粘合的作用，并使铜层结晶细密。镀铜时溶液温度必须控制在簇25℃，温度较低时，镀层光亮致密，但生产率低。温度过高时，则镀层厚，且粗糙、疏松、附着力差。溶液中Fe2+离子过多会恶化镀层质量。镀铜过程约在1一2而n内完成。(韩观昌)
