互连线,interconnect
1)interconnect[英][,?nt?k?"nekt][美]["?nt?k?"n?kt]互连线
1.Improved delay estimation method for RLCinterconnects;改进的RLC互连线延时估算方法
2.Modeling of RF Coupled Interconnects on Lossy Silicon Substrates;射频高损耗硅基双互连线建模
3.Exploiting clock circuit dynamical optimization using RLCinterconnect model;用RLC互连线模型实现时钟电路的动态优化
英文短句/例句
1.Simulation of Extremely High Order RC Interconnect Model by MatLab用MatLab仿真高阶RC模型的互连线特性
2.Investigation on Several Issues in VLSI Interconnect Process Variations;VLSI中互连线工艺变化的若干问题研究
3.Studies on Microstructure and Stress of Copper Interconnects in ULSI;ULSI铜互连线微观结构和应力研究
4.Investigation on Parallel Inverter without Control Interconnection;并联逆变器无互连线控制技术的研究
5.The Testing of Virtex FPGA Interconnects;Virtex系列FPGA内部互连线测试
6.Simulation Analysis of Transmission Line in High-Speed PCB Design高速PCB设计中互连线的仿真分析
7.Analysis for interconnect and CMOS models" influence on performance互连线和CMOS模型对性能影响的分析
8.Statistical Interconnect Timing Models Using Symbolic Moments基于符号化矩的互连线统计时序建模
9.Review of Electromigration Modeling of IC Interconnects集成电路互连线电迁移建模综述(英文)
10.Crosstalk Analysis for High-speed Interconnect Lines Based on Transfer Function基于传递函数的高速互连线串扰分析
11.RLC Parasitic Parameter Extraction and Reduced-Order Modeling of High-Frequency Transmission Lines;高频互连线RLC寄生参数提取和低阶建模
12.On the Applicability of Carbon Nanotubes as Interconnect in Nanoscale Integrated Circuits;碳纳米管在纳米集成电路互连线中的应用研究
13.interconnect tape带有引线架的互连带
14.Do not connect the unit"s speaker cords to each other.不要相互连接本机的扬声器电线。
15.Research on Quality of Service Guarantee in Wireless Mobile Internet;无线移动互连网服务质量保证的研究
16.Design of the Communication System of CAN Bus with Ethernet;基于CAN总线的以太网互连系统设计
17.The Design and Application of an Interconnection System between CAN-bus and Ethernet;CAN总线与以太网互连系统设计与应用
18.E-PROPHET in Intermittently Connected Networks间断连接无线互联网下的E-PROPHET
相关短句/例句
interconnects互连线
1.On-chip Inductance Modeling of VLSI Interconnects Basedon Neural Networks;基于神经网络的片上互连线电感提取法
2.Modeling ofinterconnects and delay analysis in the presence of Random VLSI process variationsVLSI随机工艺变化下互连线建模与延迟分析
3.To extract the 2-D capacitance distributed parameters ofinterconnects accurately and fast,a measured equation of invariance method is used to calculate the electric field ofinterconnects,and the effect of the aberration of conductor sizes on the parasitic extraction is discussed.为精确快速提取二维互连线电容分布参数,该文采用测度不变方程法计算互连线电势分布,探讨了导体尺寸微小扰动对电容分布参数的影响。
3)interconnection[英][,int?k?"nek??n][美][,?nt?k?"n?k??n]互连线
1.Design and Implementation of 3D Interconnections Capacitance Extraction;三维互连线寄生电容提取算法的设计和实现
2.This paper introduced copper as substitute for aluminum as the metalinterconnection with its low resistance rate and high resist-electron migration ability, briefed on the preparation techniques of Cu, and then discussed the new disfigurement and its solution such as groove disfigurement, bubble disfigurement and metal loosing disfigurement.在集成电路中采用双镶嵌工艺制备互连线,铜作为互连线的材料具有低电阻率和较好的抗电迁移能力等优点,同时存在新的缺陷模式如沟槽缺陷、气泡缺陷、金属缺失等,目前的工作主要是该工艺的完善。
3.Considering the serious RC network effects ofinterconnections in very high speed digital ICs, the parasitic parameters of theinterconnections with TSMC 0.分析了RC网络效应对超高速集成电路中互连线的影响 ,基于TSMC 0 。
4)interconnection line互连线
1.Finally,a method of building the Spice model with high-frequencyinterconnection line in the substrate is proposed,thus providing a foundation for coordination design of chip package.根据二端口等效电路理论,提出了建立基板高频互连线Spice模型的方法,为芯片-封装协同设计提供了依据。
2.In this case,interconnection lines between the chips in the Multi-Chip Module (MCM) or Printed Circuit Board (PCB) have become the important factors of the signal integrity and entire system performance.在现代高性能集成电路中,由于亚微米和深亚微米技术的发展,器件和单元电路的尺寸越来越小,由寄生参数引起的影响不大,而此时芯片中的单元电路间、印刷电路板(PCB)及多芯片组件(MCM)的各块芯片间的互连线的电长度较大,将会引起相当严重的寄生效应。
5)Al interconnectAl互连线
1.In order to study the failure of IC devices induced by the stress in VLSI metal interconnect, In-situ observation of the stress changes of VLSIAl interconnect was studied under the electromigration and thermal conditions by using a synchrotron radiation x-ray diffraction technique.为研究VLSI金属互连线的应力导致IC器件失效的问题,采用同步辐射源X射线衍射技术,原位测试了VLSI中Al互连线在电迁徙及加热条件下的应力变化。
6)VLSI interconnectVLSI互连线
1.It is proved that these models can be used to extract the capacitances from almost all of theVLSI interconnect structures.提出了八种节点电容典型结构用以建立电容模型库,并阐明了这八种结构可以提取大多数VLSI互连线的电容参数,给出了这些结构的拟合公式。
延伸阅读
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