堆积导通孔和填充导通孔,filled via and stacked via
1)filled via and stacked via堆积导通孔和填充导通孔
2)via fill plating导通孔填孔
3)via filled copper plating镀铜层填充导通孔
4)via fill通孔填充
5)Through hole导通孔
英文短句/例句
1.Cupric Sulfate Plating Process Cu-BRITE TFⅡ for Through-Hole and Via Filling Plating导通孔和通孔填孔镀用的CuSO_4电镀工艺“Cu-BRITE TFⅡ”
2.Impact of Via Design on High-Speed Signal Integrity导通孔设计对高速信号完整性的影响
3.conduct, of porous common pottery (excl. insulating electric conduit tubing)普通陶质多孔导管（不包括电绝缘导管管材）
4.A superconductor transfers the power from the flux aperture to the power cell.一个超导体将通行孔径的能量转到能量电池中。
5.Analysis of the Influence of Stress Induced by Cu Via on CMOS MobilityCu通孔诱导的应力对CMOS迁移率影响分析
6.Put the stripped wire into crimping hole of contact， and observe through view hole whether wire reaches its position.将剥好的导线送人接触件的压接孔内，通过观察孔可观察导线是否到位.
7.Effect of cell membrane perforation caused by myclobutanil on Spodoptera litura SL cell membrane permeability腈菌唑导致的细胞膜穿孔对斜纹夜蛾SL细胞膜通透性的影响
8.The air passage is called the air bleed.空气通道叫通气孔。
9.Sprocket holes: Feed holes in paper tape.刺轮孔:纸带上，引导纸带向前的小孔。
10.guide twist drill有导径的深孔麻花钻
11.hole-conductor current access device穿孔导体电流存取器件
12.counterbore with guide有导柱的平底扩充孔钻
13.The teachings of Confucius tell us to be humble.孔子教导我们要谦虚。
14.Study of Fabricating Metal Material with Contact-Porous by Technique of Wiping off Salt from Sintered Product of Metal and Salt by Melting or Solution;熔、溶脱盐造孔法制备金属通孔多孔材料研究
15.Airflow noise attenuation capacity of porous Al alloy with small pore diameter小孔径通孔多孔铝合金的防风降噪性能
16.Sound absorption of periodic porous aluminium with controlled pore structures孔结构周期调制通孔多孔铝合金及其吸声性能
17.That includes the installation of windlasses, winches, bollards, fireleads, masts, deck cranes, vent pipes and different kinds of rigging.包括以下部件的安装：锚机，绞车，带缆桩，导缆孔，桅杆，甲板起重机，通风口和各种索具。
18.An opening in the bow of a ship through which a cable or hawser is passed.锚链孔船首缆索或绳索通过的洞孔
相关短句/例句
via fill plating导通孔填孔
3)via filled copper plating镀铜层填充导通孔
4)via fill通孔填充
5)Through hole导通孔
6)through hole filling通孔填孔
1.The paper describes that achievesthrough hole filling by accelerator-free formulas in DC plating.文章介绍了采用不含加速剂的直流电镀方案来实现通孔填孔技术,并提出通孔填孔的可能电化学机理。
延伸阅读
堆积堆积医学上指某些物质或细胞在各种因素影响下，沉聚在细胞内或机体某一部位的现象，如脂肪堆积，也称蓄积。
